table of content
1 Introduction to Research & Analysis Reports
1.1 3D IC and 2.5D IC Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global 3D IC and 2.5D IC Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global 3D IC and 2.5D IC Overall Market Size
2.1 Global 3D IC and 2.5D IC Market Size: 2023 VS 2030
2.2 Global 3D IC and 2.5D IC Market Size, Prospects & Forecasts: 2019-2030
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top 3D IC and 2.5D IC Players in Global Market
3.2 Top Global 3D IC and 2.5D IC Companies Ranked by Revenue
3.3 Global 3D IC and 2.5D IC Revenue by Companies
3.4 Top 3 and Top 5 3D IC and 2.5D IC Companies in Global Market, by Revenue in 2023
3.5 Global Companies 3D IC and 2.5D IC Product Type
3.6 Tier 1, Tier 2 and Tier 3 3D IC and 2.5D IC Players in Global Market
3.6.1 List of Global Tier 1 3D IC and 2.5D IC Companies
3.6.2 List of Global Tier 2 and Tier 3 3D IC and 2.5D IC Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global 3D IC and 2.5D IC Market Size Markets, 2023 & 2030
4.1.2 3D Wafer-level Chip-scale Packaging
4.1.3 3D TSV
4.1.4 2.5D
4.2 By Type - Global 3D IC and 2.5D IC Revenue & Forecasts
4.2.1 By Type - Global 3D IC and 2.5D IC Revenue, 2019-2024
4.2.2 By Type - Global 3D IC and 2.5D IC Revenue, 2025-2030
4.2.3 By Type - Global 3D IC and 2.5D IC Revenue Market Share, 2019-2030
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global 3D IC and 2.5D IC Market Size, 2023 & 2030
5.1.2 Consumer Electronics
5.1.3 Telecommunication
5.1.4 Industry Sector
5.1.5 Automotive
5.1.6 Military and Aerospace
5.1.7 Smart Technologies
5.1.8 Medical Devices
5.2 By Application - Global 3D IC and 2.5D IC Revenue & Forecasts
5.2.1 By Application - Global 3D IC and 2.5D IC Revenue, 2019-2024
5.2.2 By Application - Global 3D IC and 2.5D IC Revenue, 2025-2030
5.2.3 By Application - Global 3D IC and 2.5D IC Revenue Market Share, 2019-2030
6 Sights by Region
6.1 By Region - Global 3D IC and 2.5D IC Market Size, 2023 & 2030
6.2 By Region - Global 3D IC and 2.5D IC Revenue & Forecasts
6.2.1 By Region - Global 3D IC and 2.5D IC Revenue, 2019-2024
6.2.2 By Region - Global 3D IC and 2.5D IC Revenue, 2025-2030
6.2.3 By Region - Global 3D IC and 2.5D IC Revenue Market Share, 2019-2030
6.3 North America
6.3.1 By Country - North America 3D IC and 2.5D IC Revenue, 2019-2030
6.3.2 US 3D IC and 2.5D IC Market Size, 2019-2030
6.3.3 Canada 3D IC and 2.5D IC Market Size, 2019-2030
6.3.4 Mexico 3D IC and 2.5D IC Market Size, 2019-2030
6.4 Europe
6.4.1 By Country - Europe 3D IC and 2.5D IC Revenue, 2019-2030
6.4.2 Germany 3D IC and 2.5D IC Market Size, 2019-2030
6.4.3 France 3D IC and 2.5D IC Market Size, 2019-2030
6.4.4 U.K. 3D IC and 2.5D IC Market Size, 2019-2030
6.4.5 Italy 3D IC and 2.5D IC Market Size, 2019-2030
6.4.6 Russia 3D IC and 2.5D IC Market Size, 2019-2030
6.4.7 Nordic Countries 3D IC and 2.5D IC Market Size, 2019-2030
6.4.8 Benelux 3D IC and 2.5D IC Market Size, 2019-2030
6.5 Asia
6.5.1 By Region - Asia 3D IC and 2.5D IC Revenue, 2019-2030
6.5.2 China 3D IC and 2.5D IC Market Size, 2019-2030
6.5.3 Japan 3D IC and 2.5D IC Market Size, 2019-2030
6.5.4 South Korea 3D IC and 2.5D IC Market Size, 2019-2030
6.5.5 Southeast Asia 3D IC and 2.5D IC Market Size, 2019-2030
6.5.6 India 3D IC and 2.5D IC Market Size, 2019-2030
6.6 South America
6.6.1 By Country - South America 3D IC and 2.5D IC Revenue, 2019-2030
6.6.2 Brazil 3D IC and 2.5D IC Market Size, 2019-2030
6.6.3 Argentina 3D IC and 2.5D IC Market Size, 2019-2030
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa 3D IC and 2.5D IC Revenue, 2019-2030
6.7.2 Turkey 3D IC and 2.5D IC Market Size, 2019-2030
6.7.3 Israel 3D IC and 2.5D IC Market Size, 2019-2030
6.7.4 Saudi Arabia 3D IC and 2.5D IC Market Size, 2019-2030
6.7.5 UAE 3D IC and 2.5D IC Market Size, 2019-2030
7 3D IC and 2.5D IC Companies Profiles
7.1 TSMC(Taiwan)
7.1.1 TSMC(Taiwan) Company Summary
7.1.2 TSMC(Taiwan) Business Overview
7.1.3 TSMC(Taiwan) 3D IC and 2.5D IC Major Product Offerings
7.1.4 TSMC(Taiwan) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.1.5 TSMC(Taiwan) Key News & Latest Developments
7.2 Samsung(South Korea)
7.2.1 Samsung(South Korea) Company Summary
7.2.2 Samsung(South Korea) Business Overview
7.2.3 Samsung(South Korea) 3D IC and 2.5D IC Major Product Offerings
7.2.4 Samsung(South Korea) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.2.5 Samsung(South Korea) Key News & Latest Developments
7.3 Toshiba(Japan)
7.3.1 Toshiba(Japan) Company Summary
7.3.2 Toshiba(Japan) Business Overview
7.3.3 Toshiba(Japan) 3D IC and 2.5D IC Major Product Offerings
7.3.4 Toshiba(Japan) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.3.5 Toshiba(Japan) Key News & Latest Developments
7.4 ASE Group(Taiwan)
7.4.1 ASE Group(Taiwan) Company Summary
7.4.2 ASE Group(Taiwan) Business Overview
7.4.3 ASE Group(Taiwan) 3D IC and 2.5D IC Major Product Offerings
7.4.4 ASE Group(Taiwan) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.4.5 ASE Group(Taiwan) Key News & Latest Developments
7.5 Amkor(U.S.)
7.5.1 Amkor(U.S.) Company Summary
7.5.2 Amkor(U.S.) Business Overview
7.5.3 Amkor(U.S.) 3D IC and 2.5D IC Major Product Offerings
7.5.4 Amkor(U.S.) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.5.5 Amkor(U.S.) Key News & Latest Developments
7.6 UMC(Taiwan)
7.6.1 UMC(Taiwan) Company Summary
7.6.2 UMC(Taiwan) Business Overview
7.6.3 UMC(Taiwan) 3D IC and 2.5D IC Major Product Offerings
7.6.4 UMC(Taiwan) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.6.5 UMC(Taiwan) Key News & Latest Developments
7.7 Stmicroelectronics(Switzerland)
7.7.1 Stmicroelectronics(Switzerland) Company Summary
7.7.2 Stmicroelectronics(Switzerland) Business Overview
7.7.3 Stmicroelectronics(Switzerland) 3D IC and 2.5D IC Major Product Offerings
7.7.4 Stmicroelectronics(Switzerland) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.7.5 Stmicroelectronics(Switzerland) Key News & Latest Developments
7.8 Broadcom(U.S.)
7.8.1 Broadcom(U.S.) Company Summary
7.8.2 Broadcom(U.S.) Business Overview
7.8.3 Broadcom(U.S.) 3D IC and 2.5D IC Major Product Offerings
7.8.4 Broadcom(U.S.) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.8.5 Broadcom(U.S.) Key News & Latest Developments
7.9 Intel(U.S.)
7.9.1 Intel(U.S.) Company Summary
7.9.2 Intel(U.S.) Business Overview
7.9.3 Intel(U.S.) 3D IC and 2.5D IC Major Product Offerings
7.9.4 Intel(U.S.) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.9.5 Intel(U.S.) Key News & Latest Developments
7.10 Jiangsu Changjiang Electronics(China)
7.10.1 Jiangsu Changjiang Electronics(China) Company Summary
7.10.2 Jiangsu Changjiang Electronics(China) Business Overview
7.10.3 Jiangsu Changjiang Electronics(China) 3D IC and 2.5D IC Major Product Offerings
7.10.4 Jiangsu Changjiang Electronics(China) 3D IC and 2.5D IC Revenue in Global Market (2019-2024)
7.10.5 Jiangsu Changjiang Electronics(China) Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
