table of content
1 Introduction to Research & Analysis Reports
1.1 3D IC & 2.5D IC Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global 3D IC & 2.5D IC Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global 3D IC & 2.5D IC Packaging Overall Market Size
2.1 Global 3D IC & 2.5D IC Packaging Market Size: 2023 VS 2030
2.2 Global 3D IC & 2.5D IC Packaging Revenue, Prospects & Forecasts: 2019-2030
2.3 Global 3D IC & 2.5D IC Packaging Sales: 2019-2030
3 Company Landscape
3.1 Top 3D IC & 2.5D IC Packaging Players in Global Market
3.2 Top Global 3D IC & 2.5D IC Packaging Companies Ranked by Revenue
3.3 Global 3D IC & 2.5D IC Packaging Revenue by Companies
3.4 Global 3D IC & 2.5D IC Packaging Sales by Companies
3.5 Global 3D IC & 2.5D IC Packaging Price by Manufacturer (2019-2024)
3.6 Top 3 and Top 5 3D IC & 2.5D IC Packaging Companies in Global Market, by Revenue in 2023
3.7 Global Manufacturers 3D IC & 2.5D IC Packaging Product Type
3.8 Tier 1, Tier 2 and Tier 3 3D IC & 2.5D IC Packaging Players in Global Market
3.8.1 List of Global Tier 1 3D IC & 2.5D IC Packaging Companies
3.8.2 List of Global Tier 2 and Tier 3 3D IC & 2.5D IC Packaging Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type - Global 3D IC & 2.5D IC Packaging Market Size Markets, 2023 & 2030
4.1.2 3D TSV
4.1.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
4.2 By Type - Global 3D IC & 2.5D IC Packaging Revenue & Forecasts
4.2.1 By Type - Global 3D IC & 2.5D IC Packaging Revenue, 2019-2024
4.2.2 By Type - Global 3D IC & 2.5D IC Packaging Revenue, 2025-2030
4.2.3 By Type - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
4.3 By Type - Global 3D IC & 2.5D IC Packaging Sales & Forecasts
4.3.1 By Type - Global 3D IC & 2.5D IC Packaging Sales, 2019-2024
4.3.2 By Type - Global 3D IC & 2.5D IC Packaging Sales, 2025-2030
4.3.3 By Type - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
4.4 By Type - Global 3D IC & 2.5D IC Packaging Price (Manufacturers Selling Prices), 2019-2030
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global 3D IC & 2.5D IC Packaging Market Size, 2023 & 2030
5.1.2 Automotive
5.1.3 Consumer electronics
5.1.4 Medical devices
5.1.5 Military & aerospace
5.1.6 Telecommunication
5.1.7 Industrial sector and smart technologies
5.2 By Application - Global 3D IC & 2.5D IC Packaging Revenue & Forecasts
5.2.1 By Application - Global 3D IC & 2.5D IC Packaging Revenue, 2019-2024
5.2.2 By Application - Global 3D IC & 2.5D IC Packaging Revenue, 2025-2030
5.2.3 By Application - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
5.3 By Application - Global 3D IC & 2.5D IC Packaging Sales & Forecasts
5.3.1 By Application - Global 3D IC & 2.5D IC Packaging Sales, 2019-2024
5.3.2 By Application - Global 3D IC & 2.5D IC Packaging Sales, 2025-2030
5.3.3 By Application - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
5.4 By Application - Global 3D IC & 2.5D IC Packaging Price (Manufacturers Selling Prices), 2019-2030
6 Sights by Region
6.1 By Region - Global 3D IC & 2.5D IC Packaging Market Size, 2023 & 2030
6.2 By Region - Global 3D IC & 2.5D IC Packaging Revenue & Forecasts
6.2.1 By Region - Global 3D IC & 2.5D IC Packaging Revenue, 2019-2024
6.2.2 By Region - Global 3D IC & 2.5D IC Packaging Revenue, 2025-2030
6.2.3 By Region - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
6.3 By Region - Global 3D IC & 2.5D IC Packaging Sales & Forecasts
6.3.1 By Region - Global 3D IC & 2.5D IC Packaging Sales, 2019-2024
6.3.2 By Region - Global 3D IC & 2.5D IC Packaging Sales, 2025-2030
6.3.3 By Region - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
6.4 North America
6.4.1 By Country - North America 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.4.2 By Country - North America 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.4.3 US 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.4.4 Canada 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.4.5 Mexico 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5 Europe
6.5.1 By Country - Europe 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.5.2 By Country - Europe 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.5.3 Germany 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.4 France 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.5 U.K. 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.6 Italy 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.7 Russia 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.8 Nordic Countries 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.9 Benelux 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6 Asia
6.6.1 By Region - Asia 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.6.2 By Region - Asia 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.6.3 China 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6.4 Japan 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6.5 South Korea 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6.6 Southeast Asia 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6.7 India 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.7 South America
6.7.1 By Country - South America 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.7.2 By Country - South America 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.7.3 Brazil 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.7.4 Argentina 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.8.2 By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.8.3 Turkey 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.8.4 Israel 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.8.5 Saudi Arabia 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.8.6 UAE 3D IC & 2.5D IC Packaging Market Size, 2019-2030
7 Manufacturers & Brands Profiles
7.1 Intel Corporation
7.1.1 Intel Corporation Company Summary
7.1.2 Intel Corporation Business Overview
7.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Major Product Offerings
7.1.4 Intel Corporation 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.1.5 Intel Corporation Key News & Latest Developments
7.2 Toshiba Corp
7.2.1 Toshiba Corp Company Summary
7.2.2 Toshiba Corp Business Overview
7.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Major Product Offerings
7.2.4 Toshiba Corp 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.2.5 Toshiba Corp Key News & Latest Developments
7.3 Samsung Electronics
7.3.1 Samsung Electronics Company Summary
7.3.2 Samsung Electronics Business Overview
7.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Major Product Offerings
7.3.4 Samsung Electronics 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.3.5 Samsung Electronics Key News & Latest Developments
7.4 Stmicroelectronics
7.4.1 Stmicroelectronics Company Summary
7.4.2 Stmicroelectronics Business Overview
7.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Major Product Offerings
7.4.4 Stmicroelectronics 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.4.5 Stmicroelectronics Key News & Latest Developments
7.5 Taiwan Semiconductor Manufacturing
7.5.1 Taiwan Semiconductor Manufacturing Company Summary
7.5.2 Taiwan Semiconductor Manufacturing Business Overview
7.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Major Product Offerings
7.5.4 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.5.5 Taiwan Semiconductor Manufacturing Key News & Latest Developments
7.6 Amkor Technology
7.6.1 Amkor Technology Company Summary
7.6.2 Amkor Technology Business Overview
7.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Major Product Offerings
7.6.4 Amkor Technology 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.6.5 Amkor Technology Key News & Latest Developments
7.7 United Microelectronics
7.7.1 United Microelectronics Company Summary
7.7.2 United Microelectronics Business Overview
7.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Major Product Offerings
7.7.4 United Microelectronics 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.7.5 United Microelectronics Key News & Latest Developments
7.8 Broadcom
7.8.1 Broadcom Company Summary
7.8.2 Broadcom Business Overview
7.8.3 Broadcom 3D IC & 2.5D IC Packaging Major Product Offerings
7.8.4 Broadcom 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.8.5 Broadcom Key News & Latest Developments
7.9 ASE Group
7.9.1 ASE Group Company Summary
7.9.2 ASE Group Business Overview
7.9.3 ASE Group 3D IC & 2.5D IC Packaging Major Product Offerings
7.9.4 ASE Group 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.9.5 ASE Group Key News & Latest Developments
7.10 Pure Storage
7.10.1 Pure Storage Company Summary
7.10.2 Pure Storage Business Overview
7.10.3 Pure Storage 3D IC & 2.5D IC Packaging Major Product Offerings
7.10.4 Pure Storage 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.10.5 Pure Storage Key News & Latest Developments
7.11 Advanced Semiconductor Engineering
7.11.1 Advanced Semiconductor Engineering Company Summary
7.11.2 Advanced Semiconductor Engineering Business Overview
7.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Major Product Offerings
7.11.4 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.11.5 Advanced Semiconductor Engineering Key News & Latest Developments
7.12 JCET
7.12.1 JCET Company Summary
7.12.2 JCET Business Overview
7.12.3 JCET 3D IC & 2.5D IC Packaging Major Product Offerings
7.12.4 JCET 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.12.5 JCET Key News & Latest Developments
7.13 TongFu Microelectronics
7.13.1 TongFu Microelectronics Company Summary
7.13.2 TongFu Microelectronics Business Overview
7.13.3 TongFu Microelectronics 3D IC & 2.5D IC Packaging Major Product Offerings
7.13.4 TongFu Microelectronics 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.13.5 TongFu Microelectronics Key News & Latest Developments
8 Global 3D IC & 2.5D IC Packaging Production Capacity, Analysis
8.1 Global 3D IC & 2.5D IC Packaging Production Capacity, 2019-2030
8.2 3D IC & 2.5D IC Packaging Production Capacity of Key Manufacturers in Global Market
8.3 Global 3D IC & 2.5D IC Packaging Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 3D IC & 2.5D IC Packaging Supply Chain Analysis
10.1 3D IC & 2.5D IC Packaging Industry Value Chain
10.2 3D IC & 2.5D IC Packaging Upstream Market
10.3 3D IC & 2.5D IC Packaging Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 3D IC & 2.5D IC Packaging Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer
