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The global Semiconductor Die Attach Materials market was valued at US$ 586.8 million in 2022 and is projected to reach US$ 856.5 million by 2029, at a CAGR of 5.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.
Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR's investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Die Attach Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Die Attach Materials. This report contains market size and forecasts of Semiconductor Die Attach Materials in global, including the following market information:
The major players in global Die-Attach Materials market include Alpha Assembly Solutions, SMIC, Shenmao Technology, etc. The top 3 players occupy about 40% shares of the global market. Asia Pacific and North America are main markets, they occupy about 90% of the global market. Die Attach Paste is the main type, with a share about 85%. SMT Assembly is the main application, which holds a share about 50%.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Die Attach Materials manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Die Attach Materials Market, by Type, 2018-2023, 2024-2032 ($ Millions) & (Kiloton)
Global Semiconductor Die Attach Materials Market Segment Percentages, by Type, 2022 (%)
Global Semiconductor Die Attach Materials Market, by Application, 2018-2023, 2024-2032 ($ Millions) & (Kiloton)
Global Semiconductor Die Attach Materials Market Segment Percentages, by Application, 2022 (%)
Global Semiconductor Die Attach Materials Market, By Region and Country, 2018-2023, 2024-2032 ($ Millions) & (Kiloton)
Global Semiconductor Die Attach Materials Market Segment Percentages, By Region and Country, 2022 (%)
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Die Attach Materials revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semiconductor Die Attach Materials revenues share in global market, 2022 (%)
Key companies Semiconductor Die Attach Materials sales in global market, 2018-2023 (Estimated), (Kiloton)
Key companies Semiconductor Die Attach Materials sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Outline of Major Chapters: