AiP (Antenna in Package) Module Market, Global Outlook and Forecast 2023-2030
AiP is a technology that integrates an antenna and a chip into a package to achieve system-level wireless functions. The dielectric materials of the package antenna are mainly ceramic, organic, and molding compounds, and the conductor materials are gold, silver, and copper. It implements one or more antennas in the IC package and can carry bare radio frequency chips (transceivers). AiP can be further integrated with front-end components (for example, power amplifier (PA) or low noise amplifier (LNA)), switches, filters, and even power management integrated circuits (PMIC) to form an antenna module-package (SiP) using System-in technology.
This report aims to provide a comprehensive presentation of the global market for AiP (Antenna in Package) Module, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding AiP (Antenna in Package) Module. This report contains market size and forecasts of AiP (Antenna in Package) Module in global, including the following market information:
Global AiP (Antenna in Package) Module Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global AiP (Antenna in Package) Module Market Sales, 2018-2023, 2024-2030, (K Units)
Global top five AiP (Antenna in Package) Module companies in 2022 (%)
The global AiP (Antenna in Package) Module market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
LTCC Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of AiP (Antenna in Package) Module include Qualcomm, Intel, Murata, Skyworks, Qorvo, Samsung, Broadcom and Huizhou Speed Wireless Technology, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the AiP (Antenna in Package) Module manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global AiP (Antenna in Package) Module Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global AiP (Antenna in Package) Module Market Segment Percentages, by Type, 2022 (%)
LTCC
HDI
FOWLP
Global AiP (Antenna in Package) Module Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global AiP (Antenna in Package) Module Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Vehicle Electronics
Industrial Internet of Things
Communication Base Station
Others
Global AiP (Antenna in Package) Module Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global AiP (Antenna in Package) Module Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies AiP (Antenna in Package) Module revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies AiP (Antenna in Package) Module revenues share in global market, 2022 (%)
Key companies AiP (Antenna in Package) Module sales in global market, 2018-2023 (Estimated), (K Units)
Key companies AiP (Antenna in Package) Module sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Qualcomm
Intel
Murata
Skyworks
Qorvo
Samsung
Broadcom
Huizhou Speed Wireless Technology
Outline of Major Chapters:
Chapter 1: Introduces the definition of AiP (Antenna in Package) Module, market overview.
Chapter 2: Global AiP (Antenna in Package) Module market size in revenue and volume.
Chapter 3: Detailed analysis of AiP (Antenna in Package) Module manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of AiP (Antenna in Package) Module in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global AiP (Antenna in Package) Module capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
