Through Glass Via (TGV) Glass Wafer Market, Global Outlook and Forecast 2023-2030
Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Glass Wafer, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Glass Wafer. This report contains market size and forecasts of Through Glass Via (TGV) Glass Wafer in global, including the following market information:
Global Through Glass Via (TGV) Glass Wafer Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global Through Glass Via (TGV) Glass Wafer Market Sales, 2018-2023, 2024-2030, (K Units)
Global top five Through Glass Via (TGV) Glass Wafer companies in 2022 (%)
The global Through Glass Via (TGV) Glass Wafer market was valued at US$ 57 million in 2022 and is projected to reach US$ 98.4 million by 2029, at a CAGR of 8.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
United States is the largest Through Glass Via (TGV) Wafer market with about 46% market share. Europe is follower, accounting for about 25% market share.The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking. Corning accounted for 26% of the Global Through Glass Via (TGV) Wafer Production Value market share. Other players accounted for 21%, 11% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.
We surveyed the Through Glass Via (TGV) Glass Wafer manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Through Glass Via (TGV) Glass Wafer Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Through Glass Via (TGV) Glass Wafer Market Segment Percentages, by Type, 2022 (%)
300 mm Glass Wafer
200 mm Glass Wafer
?150 mm Glass Wafer
Global Through Glass Via (TGV) Glass Wafer Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Through Glass Via (TGV) Glass Wafer Market Segment Percentages, by Application, 2022 (%)
Biotechnology/Medical
Consumer Electronics
Automotive
Others
Global Through Glass Via (TGV) Glass Wafer Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Through Glass Via (TGV) Glass Wafer Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Through Glass Via (TGV) Glass Wafer revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Through Glass Via (TGV) Glass Wafer revenues share in global market, 2022 (%)
Key companies Through Glass Via (TGV) Glass Wafer sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Through Glass Via (TGV) Glass Wafer sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
Outline of Major Chapters:
Chapter 1: Introduces the definition of Through Glass Via (TGV) Glass Wafer, market overview.
Chapter 2: Global Through Glass Via (TGV) Glass Wafer market size in revenue and volume.
Chapter 3: Detailed analysis of Through Glass Via (TGV) Glass Wafer manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Through Glass Via (TGV) Glass Wafer in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Through Glass Via (TGV) Glass Wafer capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
