Outsourced Semiconductor Assembly Service Market, Global Outlook and Forecast 2023-2030
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries. This report focuses on Outsourced Semiconductor Assembly Service market.
This report aims to provide a comprehensive presentation of the global market for Outsourced Semiconductor Assembly Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Outsourced Semiconductor Assembly Service. This report contains market size and forecasts of Outsourced Semiconductor Assembly Service in global, including the following market information:
Global Outsourced Semiconductor Assembly Service Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global top five companies in 2022 (%)
The global Outsourced Semiconductor Assembly Service market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Advanced Packaging Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Outsourced Semiconductor Assembly Service include ASE, Amkor Technology, JCET, SPIL, Powertech Technology Inc., TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Outsourced Semiconductor Assembly Service companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Outsourced Semiconductor Assembly Service Market, by Type, 2018-2023, 2024-2030 ($ millions)
Global Outsourced Semiconductor Assembly Service Market Segment Percentages, by Type, 2022 (%)
Advanced Packaging
Traditional Packaging
Global Outsourced Semiconductor Assembly Service Market, by Application, 2018-2023, 2024-2030 ($ millions)
Global Outsourced Semiconductor Assembly Service Market Segment Percentages, by Application, 2022 (%)
Automotive and Transportation
Consumer Electronics
Communication
Others
Global Outsourced Semiconductor Assembly Service Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions)
Global Outsourced Semiconductor Assembly Service Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Outsourced Semiconductor Assembly Service revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Outsourced Semiconductor Assembly Service revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE
Amkor Technology
JCET
SPIL
Powertech Technology Inc.
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
Outline of Major Chapters:
Chapter 1: Introduces the definition of Outsourced Semiconductor Assembly Service, market overview.
Chapter 2: Global Outsourced Semiconductor Assembly Service market size in revenue.
Chapter 3: Detailed analysis of Outsourced Semiconductor Assembly Service company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Outsourced Semiconductor Assembly Service in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
