Flip Chip Technology Market, Global Outlook and Forecast 2024-2031
In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
This report aims to provide a comprehensive presentation of the global market for Flip Chip Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip Technology. This report contains market size and forecasts of Flip Chip Technology in global, including the following market information:
Global Flip Chip Technology Market Revenue, 2019-2024, 2024-2029, ($ millions)
Global top five companies in 2023 (%)
The global Flip Chip Technology market was valued at US$ 22120 million in 2023 and is projected to reach US$ 32280 million by 2029, at a CAGR of 5.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The APAC held a large share of the overall flip chip technology market in 2017.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Flip Chip Technology companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Flip Chip Technology Market, by Type, 2019-2024, 2024-2029 ($ millions)
Global Flip Chip Technology Market Segment Percentages, by Type, 2023 (%)
Packaging Technology
Mosaic Technology
Other
Global Flip Chip Technology Market, by Application, 2019-2024, 2024-2029 ($ millions)
Global Flip Chip Technology Market Segment Percentages, by Application, 2023 (%)
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace
Global Flip Chip Technology Market, By Region and Country, 2019-2024, 2024-2029 ($ Millions)
Global Flip Chip Technology Market Segment Percentages, By Region and Country, 2023 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Flip Chip Technology revenues in global market, 2019-2024 (estimated), ($ millions)
Key companies Flip Chip Technology revenues share in global market, 2023 (%)
Further, the report presents profiles of competitors in the market, key players include:
Samsung
Intel
Global Foundries
UMC
ASE
Amkor
STATS ChipPAC
Powertech
STMicroelectronics
Texas Instruments
Outline of Major Chapters:
Chapter 1: Introduces the definition of Flip Chip Technology, market overview.
Chapter 2: Global Flip Chip Technology market size in revenue.
Chapter 3: Detailed analysis of Flip Chip Technology company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Flip Chip Technology in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
