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Thermal Imaging Core Module Market, Global Outlook and Forecast 2024-2030

The global Thermal Imaging Core Module market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

The U.S. Market is Estimated at $ Million in 2023, While China is Forecast to Reach $ Million.
Uncooled Type Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Thermal Imaging Core Module include Teledyne FLIR, Lynred, Wuhan Guide Infrared Co., Ltd., Zhejiang Dali Technology Co.,Ltd., Leonardo DRS, BAE Systems, Semi Conductor Devices (SCD), L3Harris Technologies and IRay Technology Co., Ltd., etc. in 2023, the global top five players have a share approximately % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for Thermal Imaging Core Module, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermal Imaging Core Module. This report contains market size and forecasts of Thermal Imaging Core Module in global, including the following market information:

  • Global Thermal Imaging Core Module Market Revenue, 2019-2024, 2025-2030, ($ millions)
  • Global Thermal Imaging Core Module Market Sales, 2019-2024, 2025-2030, (K Units)
  • Global top five Thermal Imaging Core Module companies in 2023 (%)

We surveyed the Thermal Imaging Core Module manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thermal Imaging Core Module Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Thermal Imaging Core Module Market Segment Percentages, by Type, 2023 (%)

  • Uncooled Type
  • Cooled Type

Global Thermal Imaging Core Module Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Thermal Imaging Core Module Market Segment Percentages, by Application, 2023 (%)

  • Civil Use
  • Military Use

Global Thermal Imaging Core Module Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Thermal Imaging Core Module Market Segment Percentages, By Region and Country, 2023 (%)

  • North America (United States, Canada, Mexico)
  • Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
  • Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
  • The Middle East and Africa (Middle East, Africa)
  • South and Central America (Brazil, Argentina, Rest of SCA)

Competitor Analysis
The report also provides analysis of leading market participants including:

  • Key companies Thermal Imaging Core Module revenues in global market, 2019-2024 (Estimated), ($ millions)
  • Key companies Thermal Imaging Core Module revenues share in global market, 2023 (%)
  • Key companies Thermal Imaging Core Module sales in global market, 2019-2024 (Estimated), (K Units)
  • Key companies Thermal Imaging Core Module sales share in global market, 2023 (%)

Further, the report presents profiles of competitors in the market, key players include:

  • Teledyne FLIR
  • Lynred
  • Wuhan Guide Infrared Co., Ltd.
  • Zhejiang Dali Technology Co.,Ltd.
  • Leonardo DRS
  • BAE Systems
  • Semi Conductor Devices (SCD)
  • L3Harris Technologies
  • IRay Technology Co., Ltd.
  • North GuangWei Technology Inc.
  • Shenzhen Dianyang Technology Co., Ltd.
  • NEC
  • Hamamatsu Photonics

Outline of Major Chapters:
Chapter 1: Introduces the definition of Thermal Imaging Core Module, market overview.
Chapter 2: Global Thermal Imaging Core Module market size in revenue and volume.
Chapter 3: Detailed analysis of Thermal Imaging Core Module manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thermal Imaging Core Module in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Thermal Imaging Core Module capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.