The global 3D IC & 2.5D IC Packaging market was valued at US$ 6558.9 million in 2023 and is projected to reach US$ 20350 million by 2030, at a CAGR of 17.7% during the forecast period.
The USA market for Global 3D IC & 2.5D IC Packaging market is estimated to increase from USD million in 2023 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
The China market for Global 3D IC & 2.5D IC Packaging market is estimated to increase from USD million in 2023 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
The Europe market for Global 3D IC & 2.5D IC Packaging market is estimated to increase from USD million in 2023 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.
This research report provides a comprehensive analysis of the 3D IC & 2.5D IC Packaging market, focusing on the current trends, market dynamics, and future prospects. The report explores the global 3D IC & 2.5D IC Packaging market, including major regions such as North America, Europe, Asia-Pacific, and emerging markets. It also examines key factors driving the growth of 3D IC & 2.5D IC Packaging, challenges faced by the industry, and potential opportunities for market players.
The global 3D IC & 2.5D IC Packaging market has witnessed rapid growth in recent years, driven by increasing environmental concerns, government incentives, and advancements in technology. The 3D IC & 2.5D IC Packaging market presents opportunities for various stakeholders, including Automotive, Consumer electronics. Collaboration between the private sector and governments can accelerate the development of supportive policies, research and development efforts, and investment in 3D IC & 2.5D IC Packaging market. Additionally, the growing consumer demand present avenues for market expansion.
The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
Key Features:
The research report on the 3D IC & 2.5D IC Packaging market includes several key features to provide comprehensive insights and facilitate decision-making for stakeholders.
Executive Summary: The report provides overview of the key findings, market trends, and major insights of the 3D IC & 2.5D IC Packaging market.
Market Overview: The report provides a comprehensive overview of the 3D IC & 2.5D IC Packaging market, including its definition, historical development, and current market size. It covers market segmentation by Type (e.g., 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)), region, and application, highlighting the key drivers, challenges, and opportunities within each segment.
Market Dynamics: The report analyses the market dynamics driving the growth and development of the 3D IC & 2.5D IC Packaging market. The report includes an assessment of government policies and regulations, technological advancements, consumer trends and preferences, infrastructure development, and industry collaborations. This analysis helps stakeholders understand the factors influencing the 3D IC & 2.5D IC Packaging market's trajectory.
Competitive Landscape: The report provides an in-depth analysis of the competitive landscape within the 3D IC & 2.5D IC Packaging market. It includes profiles of major market players, their market share, strategies, product portfolios, and recent developments.
Market Segmentation and Forecast: The report segment the 3D IC & 2.5D IC Packaging market based on various parameters, such as by Type, region, and by Application. It provides market size and growth forecasts for each segment, supported by quantitative data and analysis. This helps stakeholders identify growth opportunities and make informed investment decisions.
Technological Trends: The report should highlight the key technological trends shaping the 3D IC & 2.5D IC Packaging market, such as advancements in Type One technology and emerging substitutes. It analyses the impact of these trends on market growth, adoption rates, and consumer preferences.
Market Challenges and Opportunities: The report identify and analyses the major challenges faced by the 3D IC & 2.5D IC Packaging market, such as technical bottleneck, cost limitations, and high entry barrier. It also highlights the opportunities for market growth, such as government incentives, emerging markets, and collaborations between stakeholders.
Regulatory and Policy Analysis: The report should assess the regulatory and policy landscape for 3D IC & 2.5D IC Packaging, including government incentives, emission standards, and infrastructure development plans. It should analyse the impact of these policies on market growth and provide insights into future regulatory developments.
Recommendations and Conclusion: The report conclude with actionable recommendations for stakeholders, such as Application One Consumer, policymakers, investors, and infrastructure providers. These recommendations should be based on the research findings and address key challenges and opportunities within the 3D IC & 2.5D IC Packaging market.
Supporting Data and Appendices: The report include supporting data, charts, and graphs to substantiate the analysis and findings. It also includes appendices with additional detailed information, such as data sources, survey questionnaires, and detailed market forecasts.
Market Segmentation
3D IC & 2.5D IC Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
- 3D TSV
- 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Market segment by Application
- Automotive
- Consumer electronics
- Medical devices
- Military & aerospace
- Telecommunication
- Industrial sector and smart technologies
Global 3D IC & 2.5D IC Packaging Market Segment Percentages, By Region and Country, 2023 (%)
- North America (United States, Canada, Mexico)
- Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
- Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
- The Middle East and Africa (Middle East, Africa)
- South and Central America (Brazil, Argentina, Rest of SCA)
Major players covered
- Intel Corporation
- Toshiba Corp
- Samsung Electronics
- Stmicroelectronics
- Taiwan Semiconductor Manufacturing
- Amkor Technology
- United Microelectronics
- Broadcom
- ASE Group
- Pure Storage
- Advanced Semiconductor Engineering
- JCET
- TongFu Microelectronics
Outline of Major Chapters:
Chapter 1: Introduces the definition of 3D IC & 2.5D IC Packaging, market overview.
Chapter 2: Global 3D IC & 2.5D IC Packaging market size in revenue and volume.
Chapter 3: Detailed analysis of 3D IC & 2.5D IC Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of 3D IC & 2.5D IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global 3D IC & 2.5D IC Packaging capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
TABLE OF CONTENTS
1 Introduction to Research & Analysis Reports
1.1 3D IC & 2.5D IC Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global 3D IC & 2.5D IC Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global 3D IC & 2.5D IC Packaging Overall Market Size
2.1 Global 3D IC & 2.5D IC Packaging Market Size: 2023 VS 2030
2.2 Global 3D IC & 2.5D IC Packaging Revenue, Prospects & Forecasts: 2019-2030
2.3 Global 3D IC & 2.5D IC Packaging Sales: 2019-2030
3 Company Landscape
3.1 Top 3D IC & 2.5D IC Packaging Players in Global Market
3.2 Top Global 3D IC & 2.5D IC Packaging Companies Ranked by Revenue
3.3 Global 3D IC & 2.5D IC Packaging Revenue by Companies
3.4 Global 3D IC & 2.5D IC Packaging Sales by Companies
3.5 Global 3D IC & 2.5D IC Packaging Price by Manufacturer (2019-2024)
3.6 Top 3 and Top 5 3D IC & 2.5D IC Packaging Companies in Global Market, by Revenue in 2023
3.7 Global Manufacturers 3D IC & 2.5D IC Packaging Product Type
3.8 Tier 1, Tier 2 and Tier 3 3D IC & 2.5D IC Packaging Players in Global Market
3.8.1 List of Global Tier 1 3D IC & 2.5D IC Packaging Companies
3.8.2 List of Global Tier 2 and Tier 3 3D IC & 2.5D IC Packaging Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type - Global 3D IC & 2.5D IC Packaging Market Size Markets, 2023 & 2030
4.1.2 3D TSV
4.1.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
4.2 By Type - Global 3D IC & 2.5D IC Packaging Revenue & Forecasts
4.2.1 By Type - Global 3D IC & 2.5D IC Packaging Revenue, 2019-2024
4.2.2 By Type - Global 3D IC & 2.5D IC Packaging Revenue, 2025-2030
4.2.3 By Type - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
4.3 By Type - Global 3D IC & 2.5D IC Packaging Sales & Forecasts
4.3.1 By Type - Global 3D IC & 2.5D IC Packaging Sales, 2019-2024
4.3.2 By Type - Global 3D IC & 2.5D IC Packaging Sales, 2025-2030
4.3.3 By Type - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
4.4 By Type - Global 3D IC & 2.5D IC Packaging Price (Manufacturers Selling Prices), 2019-2030
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global 3D IC & 2.5D IC Packaging Market Size, 2023 & 2030
5.1.2 Automotive
5.1.3 Consumer electronics
5.1.4 Medical devices
5.1.5 Military & aerospace
5.1.6 Telecommunication
5.1.7 Industrial sector and smart technologies
5.2 By Application - Global 3D IC & 2.5D IC Packaging Revenue & Forecasts
5.2.1 By Application - Global 3D IC & 2.5D IC Packaging Revenue, 2019-2024
5.2.2 By Application - Global 3D IC & 2.5D IC Packaging Revenue, 2025-2030
5.2.3 By Application - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
5.3 By Application - Global 3D IC & 2.5D IC Packaging Sales & Forecasts
5.3.1 By Application - Global 3D IC & 2.5D IC Packaging Sales, 2019-2024
5.3.2 By Application - Global 3D IC & 2.5D IC Packaging Sales, 2025-2030
5.3.3 By Application - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
5.4 By Application - Global 3D IC & 2.5D IC Packaging Price (Manufacturers Selling Prices), 2019-2030
6 Sights by Region
6.1 By Region - Global 3D IC & 2.5D IC Packaging Market Size, 2023 & 2030
6.2 By Region - Global 3D IC & 2.5D IC Packaging Revenue & Forecasts
6.2.1 By Region - Global 3D IC & 2.5D IC Packaging Revenue, 2019-2024
6.2.2 By Region - Global 3D IC & 2.5D IC Packaging Revenue, 2025-2030
6.2.3 By Region - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
6.3 By Region - Global 3D IC & 2.5D IC Packaging Sales & Forecasts
6.3.1 By Region - Global 3D IC & 2.5D IC Packaging Sales, 2019-2024
6.3.2 By Region - Global 3D IC & 2.5D IC Packaging Sales, 2025-2030
6.3.3 By Region - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
6.4 North America
6.4.1 By Country - North America 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.4.2 By Country - North America 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.4.3 US 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.4.4 Canada 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.4.5 Mexico 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5 Europe
6.5.1 By Country - Europe 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.5.2 By Country - Europe 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.5.3 Germany 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.4 France 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.5 U.K. 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.6 Italy 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.7 Russia 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.8 Nordic Countries 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.5.9 Benelux 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6 Asia
6.6.1 By Region - Asia 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.6.2 By Region - Asia 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.6.3 China 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6.4 Japan 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6.5 South Korea 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6.6 Southeast Asia 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.6.7 India 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.7 South America
6.7.1 By Country - South America 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.7.2 By Country - South America 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.7.3 Brazil 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.7.4 Argentina 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Revenue, 2019-2030
6.8.2 By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Sales, 2019-2030
6.8.3 Turkey 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.8.4 Israel 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.8.5 Saudi Arabia 3D IC & 2.5D IC Packaging Market Size, 2019-2030
6.8.6 UAE 3D IC & 2.5D IC Packaging Market Size, 2019-2030
7 Manufacturers & Brands Profiles
7.1 Intel Corporation
7.1.1 Intel Corporation Company Summary
7.1.2 Intel Corporation Business Overview
7.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Major Product Offerings
7.1.4 Intel Corporation 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.1.5 Intel Corporation Key News & Latest Developments
7.2 Toshiba Corp
7.2.1 Toshiba Corp Company Summary
7.2.2 Toshiba Corp Business Overview
7.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Major Product Offerings
7.2.4 Toshiba Corp 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.2.5 Toshiba Corp Key News & Latest Developments
7.3 Samsung Electronics
7.3.1 Samsung Electronics Company Summary
7.3.2 Samsung Electronics Business Overview
7.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Major Product Offerings
7.3.4 Samsung Electronics 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.3.5 Samsung Electronics Key News & Latest Developments
7.4 Stmicroelectronics
7.4.1 Stmicroelectronics Company Summary
7.4.2 Stmicroelectronics Business Overview
7.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Major Product Offerings
7.4.4 Stmicroelectronics 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.4.5 Stmicroelectronics Key News & Latest Developments
7.5 Taiwan Semiconductor Manufacturing
7.5.1 Taiwan Semiconductor Manufacturing Company Summary
7.5.2 Taiwan Semiconductor Manufacturing Business Overview
7.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Major Product Offerings
7.5.4 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.5.5 Taiwan Semiconductor Manufacturing Key News & Latest Developments
7.6 Amkor Technology
7.6.1 Amkor Technology Company Summary
7.6.2 Amkor Technology Business Overview
7.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Major Product Offerings
7.6.4 Amkor Technology 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.6.5 Amkor Technology Key News & Latest Developments
7.7 United Microelectronics
7.7.1 United Microelectronics Company Summary
7.7.2 United Microelectronics Business Overview
7.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Major Product Offerings
7.7.4 United Microelectronics 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.7.5 United Microelectronics Key News & Latest Developments
7.8 Broadcom
7.8.1 Broadcom Company Summary
7.8.2 Broadcom Business Overview
7.8.3 Broadcom 3D IC & 2.5D IC Packaging Major Product Offerings
7.8.4 Broadcom 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.8.5 Broadcom Key News & Latest Developments
7.9 ASE Group
7.9.1 ASE Group Company Summary
7.9.2 ASE Group Business Overview
7.9.3 ASE Group 3D IC & 2.5D IC Packaging Major Product Offerings
7.9.4 ASE Group 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.9.5 ASE Group Key News & Latest Developments
7.10 Pure Storage
7.10.1 Pure Storage Company Summary
7.10.2 Pure Storage Business Overview
7.10.3 Pure Storage 3D IC & 2.5D IC Packaging Major Product Offerings
7.10.4 Pure Storage 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.10.5 Pure Storage Key News & Latest Developments
7.11 Advanced Semiconductor Engineering
7.11.1 Advanced Semiconductor Engineering Company Summary
7.11.2 Advanced Semiconductor Engineering Business Overview
7.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Major Product Offerings
7.11.4 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.11.5 Advanced Semiconductor Engineering Key News & Latest Developments
7.12 JCET
7.12.1 JCET Company Summary
7.12.2 JCET Business Overview
7.12.3 JCET 3D IC & 2.5D IC Packaging Major Product Offerings
7.12.4 JCET 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.12.5 JCET Key News & Latest Developments
7.13 TongFu Microelectronics
7.13.1 TongFu Microelectronics Company Summary
7.13.2 TongFu Microelectronics Business Overview
7.13.3 TongFu Microelectronics 3D IC & 2.5D IC Packaging Major Product Offerings
7.13.4 TongFu Microelectronics 3D IC & 2.5D IC Packaging Sales and Revenue in Global (2019-2024)
7.13.5 TongFu Microelectronics Key News & Latest Developments
8 Global 3D IC & 2.5D IC Packaging Production Capacity, Analysis
8.1 Global 3D IC & 2.5D IC Packaging Production Capacity, 2019-2030
8.2 3D IC & 2.5D IC Packaging Production Capacity of Key Manufacturers in Global Market
8.3 Global 3D IC & 2.5D IC Packaging Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 3D IC & 2.5D IC Packaging Supply Chain Analysis
10.1 3D IC & 2.5D IC Packaging Industry Value Chain
10.2 3D IC & 2.5D IC Packaging Upstream Market
10.3 3D IC & 2.5D IC Packaging Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 3D IC & 2.5D IC Packaging Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer
LIST OF TABLES & FIGURES
List of Tables
Table 1. Key Players of 3D IC & 2.5D IC Packaging in Global Market
Table 2. Top 3D IC & 2.5D IC Packaging Players in Global Market, Ranking by Revenue (2023)
Table 3. Global 3D IC & 2.5D IC Packaging Revenue by Companies, (US$, Mn), 2019-2024
Table 4. Global 3D IC & 2.5D IC Packaging Revenue Share by Companies, 2019-2024
Table 5. Global 3D IC & 2.5D IC Packaging Sales by Companies, (K Units), 2019-2024
Table 6. Global 3D IC & 2.5D IC Packaging Sales Share by Companies, 2019-2024
Table 7. Key Manufacturers 3D IC & 2.5D IC Packaging Price (2019-2024) & (USD/Unit)
Table 8. Global Manufacturers 3D IC & 2.5D IC Packaging Product Type
Table 9. List of Global Tier 1 3D IC & 2.5D IC Packaging Companies, Revenue (US$, Mn) in 2023 and Market Share
Table 10. List of Global Tier 2 and Tier 3 3D IC & 2.5D IC Packaging Companies, Revenue (US$, Mn) in 2023 and Market Share
Table 11. By Type ? Global 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2023 & 2030
Table 12. By Type - Global 3D IC & 2.5D IC Packaging Revenue (US$, Mn), 2019-2024
Table 13. By Type - Global 3D IC & 2.5D IC Packaging Revenue (US$, Mn), 2025-2030
Table 14. By Type - Global 3D IC & 2.5D IC Packaging Sales (K Units), 2019-2024
Table 15. By Type - Global 3D IC & 2.5D IC Packaging Sales (K Units), 2025-2030
Table 16. By Application ? Global 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2023 & 2030
Table 17. By Application - Global 3D IC & 2.5D IC Packaging Revenue (US$, Mn), 2019-2024
Table 18. By Application - Global 3D IC & 2.5D IC Packaging Revenue (US$, Mn), 2025-2030
Table 19. By Application - Global 3D IC & 2.5D IC Packaging Sales (K Units), 2019-2024
Table 20. By Application - Global 3D IC & 2.5D IC Packaging Sales (K Units), 2025-2030
Table 21. By Region ? Global 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2023 VS 2030
Table 22. By Region - Global 3D IC & 2.5D IC Packaging Revenue (US$, Mn), 2019-2024
Table 23. By Region - Global 3D IC & 2.5D IC Packaging Revenue (US$, Mn), 2025-2030
Table 24. By Region - Global 3D IC & 2.5D IC Packaging Sales (K Units), 2019-2024
Table 25. By Region - Global 3D IC & 2.5D IC Packaging Sales (K Units), 2025-2030
Table 26. By Country - North America 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2024
Table 27. By Country - North America 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2025-2030
Table 28. By Country - North America 3D IC & 2.5D IC Packaging Sales, (K Units), 2019-2024
Table 29. By Country - North America 3D IC & 2.5D IC Packaging Sales, (K Units), 2025-2030
Table 30. By Country - Europe 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2024
Table 31. By Country - Europe 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2025-2030
Table 32. By Country - Europe 3D IC & 2.5D IC Packaging Sales, (K Units), 2019-2024
Table 33. By Country - Europe 3D IC & 2.5D IC Packaging Sales, (K Units), 2025-2030
Table 34. By Region - Asia 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2024
Table 35. By Region - Asia 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2025-2030
Table 36. By Region - Asia 3D IC & 2.5D IC Packaging Sales, (K Units), 2019-2024
Table 37. By Region - Asia 3D IC & 2.5D IC Packaging Sales, (K Units), 2025-2030
Table 38. By Country - South America 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2024
Table 39. By Country - South America 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2025-2030
Table 40. By Country - South America 3D IC & 2.5D IC Packaging Sales, (K Units), 2019-2024
Table 41. By Country - South America 3D IC & 2.5D IC Packaging Sales, (K Units), 2025-2030
Table 42. By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2024
Table 43. By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2025-2030
Table 44. By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Sales, (K Units), 2019-2024
Table 45. By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Sales, (K Units), 2025-2030
Table 46. Intel Corporation Company Summary
Table 47. Intel Corporation 3D IC & 2.5D IC Packaging Product Offerings
Table 48. Intel Corporation 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 49. Intel Corporation Key News & Latest Developments
Table 50. Toshiba Corp Company Summary
Table 51. Toshiba Corp 3D IC & 2.5D IC Packaging Product Offerings
Table 52. Toshiba Corp 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 53. Toshiba Corp Key News & Latest Developments
Table 54. Samsung Electronics Company Summary
Table 55. Samsung Electronics 3D IC & 2.5D IC Packaging Product Offerings
Table 56. Samsung Electronics 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 57. Samsung Electronics Key News & Latest Developments
Table 58. Stmicroelectronics Company Summary
Table 59. Stmicroelectronics 3D IC & 2.5D IC Packaging Product Offerings
Table 60. Stmicroelectronics 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 61. Stmicroelectronics Key News & Latest Developments
Table 62. Taiwan Semiconductor Manufacturing Company Summary
Table 63. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product Offerings
Table 64. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 65. Taiwan Semiconductor Manufacturing Key News & Latest Developments
Table 66. Amkor Technology Company Summary
Table 67. Amkor Technology 3D IC & 2.5D IC Packaging Product Offerings
Table 68. Amkor Technology 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 69. Amkor Technology Key News & Latest Developments
Table 70. United Microelectronics Company Summary
Table 71. United Microelectronics 3D IC & 2.5D IC Packaging Product Offerings
Table 72. United Microelectronics 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 73. United Microelectronics Key News & Latest Developments
Table 74. Broadcom Company Summary
Table 75. Broadcom 3D IC & 2.5D IC Packaging Product Offerings
Table 76. Broadcom 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 77. Broadcom Key News & Latest Developments
Table 78. ASE Group Company Summary
Table 79. ASE Group 3D IC & 2.5D IC Packaging Product Offerings
Table 80. ASE Group 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 81. ASE Group Key News & Latest Developments
Table 82. Pure Storage Company Summary
Table 83. Pure Storage 3D IC & 2.5D IC Packaging Product Offerings
Table 84. Pure Storage 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 85. Pure Storage Key News & Latest Developments
Table 86. Advanced Semiconductor Engineering Company Summary
Table 87. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product Offerings
Table 88. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 89. Advanced Semiconductor Engineering Key News & Latest Developments
Table 90. JCET Company Summary
Table 91. JCET 3D IC & 2.5D IC Packaging Product Offerings
Table 92. JCET 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 93. JCET Key News & Latest Developments
Table 94. TongFu Microelectronics Company Summary
Table 95. TongFu Microelectronics 3D IC & 2.5D IC Packaging Product Offerings
Table 96. TongFu Microelectronics 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$, Mn) and Average Price (USD/Unit) (2019-2024)
Table 97. TongFu Microelectronics Key News & Latest Developments
Table 98. 3D IC & 2.5D IC Packaging Production Capacity (K Units) of Key Manufacturers in Global Market, 2022-2024 (K Units)
Table 99. Global 3D IC & 2.5D IC Packaging Capacity Market Share of Key Manufacturers, 2022-2024
Table 100. Global 3D IC & 2.5D IC Packaging Production by Region, 2019-2024 (K Units)
Table 101. Global 3D IC & 2.5D IC Packaging Production by Region, 2025-2030 (K Units)
Table 102. 3D IC & 2.5D IC Packaging Market Opportunities & Trends in Global Market
Table 103. 3D IC & 2.5D IC Packaging Market Drivers in Global Market
Table 104. 3D IC & 2.5D IC Packaging Market Restraints in Global Market
Table 105. 3D IC & 2.5D IC Packaging Raw Materials
Table 106. 3D IC & 2.5D IC Packaging Raw Materials Suppliers in Global Market
Table 107. Typical 3D IC & 2.5D IC Packaging Downstream
Table 108. 3D IC & 2.5D IC Packaging Downstream Clients in Global Market
Table 109. 3D IC & 2.5D IC Packaging Distributors and Sales Agents in Global Market
List of Figures
Figure 1. 3D IC & 2.5D IC Packaging Segment by Type in 2023
Figure 2. 3D IC & 2.5D IC Packaging Segment by Application in 2023
Figure 3. Global 3D IC & 2.5D IC Packaging Market Overview: 2023
Figure 4. Key Caveats
Figure 5. Global 3D IC & 2.5D IC Packaging Market Size: 2023 VS 2030 (US$, Mn)
Figure 6. Global 3D IC & 2.5D IC Packaging Revenue, 2019-2030 (US$, Mn)
Figure 7. 3D IC & 2.5D IC Packaging Sales in Global Market: 2019-2030 (K Units)
Figure 8. The Top 3 and 5 Players Market Share by 3D IC & 2.5D IC Packaging Revenue in 2023
Figure 9. By Type - Global 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2023 & 2030
Figure 10. By Type - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
Figure 11. By Type - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
Figure 12. By Type - Global 3D IC & 2.5D IC Packaging Price (USD/Unit), 2019-2030
Figure 13. By Application - Global 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2023 & 2030
Figure 14. By Application - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
Figure 15. By Application - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
Figure 16. By Application - Global 3D IC & 2.5D IC Packaging Price (USD/Unit), 2019-2030
Figure 17. By Region - Global 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2023 & 2030
Figure 18. By Region - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019 VS 2023 VS 2030
Figure 19. By Region - Global 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
Figure 20. By Region - Global 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
Figure 21. By Country - North America 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
Figure 22. By Country - North America 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
Figure 23. US 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 24. Canada 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 25. Mexico 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 26. By Country - Europe 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
Figure 27. By Country - Europe 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
Figure 28. Germany 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 29. France 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 30. U.K. 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 31. Italy 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 32. Russia 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 33. Nordic Countries 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 34. Benelux 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 35. By Region - Asia 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
Figure 36. By Region - Asia 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
Figure 37. China 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 38. Japan 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 39. South Korea 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 40. Southeast Asia 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 41. India 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 42. By Country - South America 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
Figure 43. By Country - South America 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
Figure 44. Brazil 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 45. Argentina 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 46. By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Revenue Market Share, 2019-2030
Figure 47. By Country - Middle East & Africa 3D IC & 2.5D IC Packaging Sales Market Share, 2019-2030
Figure 48. Turkey 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 49. Israel 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 50. Saudi Arabia 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 51. UAE 3D IC & 2.5D IC Packaging Revenue, (US$, Mn), 2019-2030
Figure 52. Global 3D IC & 2.5D IC Packaging Production Capacity (K Units), 2019-2030
Figure 53. The Percentage of Production 3D IC & 2.5D IC Packaging by Region, 2023 VS 2030
Figure 54. 3D IC & 2.5D IC Packaging Industry Value Chain
Figure 55. Marketing Channels
